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We would like to reduce the gerber pads of a 100 pin device by 80%.

We would like to reduce the gerber pads of a 100 pin device by 80%. Also, on the mask layer the pads overlap and we would also like to separate them to individual pads. How could we accomplish this task?
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You can reduce the pad sizes for both the chip and mask simultaneously.  By reducing 80% (as you requested) the mask pads will be individually separated.  Please see my quick tutorial below (no sound):

https://numericalsoftware-update.s3.amazonaws.com/tutorials/2015-05-18_8-47-44.mp4


Here's notes from the tutorial:
1.  Using selection filter select rectangular pads for 100 pin IC device.
Note:  Make sure both Top metal and Top Mask are displayed.

2.  Use command "Scale Pads"

3.  Reduce by 80%

Now you will see by performing reduction, the mask pads are separated.

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